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Thermal design review with internal/external partners. Work with our Asia development partners through the course of a program, especially focus on simulation model review and the supervisor of hands-on works. Work with thermal facility vendors to build up thermal lab and make them activated, come out detail instruction for all thermal stuff in lab also be required. Thermal/Performance validation for urgent case is needed for quick turnaround with team. Collaborate with mechanical engineering, electrical engineering, Software, and many other engineering and design disciplines to optimize the overall system of the product throughout the course of development and into production. Conducts design/debug investigations and support development, maintenance, failure analysis, and resolution activities. Ensure that development partners are working with the same attention to detail. Review partner proposals for technical feasibility and help to ascertain risk to develop the program. Some travel will be required to support build activities. Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience. OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience. OR equivalent experience. Minimum MS in Mechanical/Thermal Engineering or related field. 10+ years of experience in thermal designing, implementing, and shipping high volume consumer electronics products of medium to high complexity. Hands-on thermal design and factory shipping experience required in a broad-range of tablet/laptop systems. Deep understanding of thermal module design, thermal/airflow simulation and thermal related acoustic knowledge and manufacturing techniques. Experience preferred with lab construction. Solid skill needs for thermal simulation modeling, troubleshooting by FloTherm, FloThermXT and FloEFD. Understanding of system structures, thermals and test criteria to develop a quality product. Solid problem solving and debug and failure analysis skills with a solid understanding of core engineering principles, and analytical techniques as required to help guide our Asia development partners. Solid communication skills required, including the ability to clearly express technical concepts in verbal and written forms. Experience preferred with small form factor mobile PC, familiar with both active and passive solution in system design and high power gaming/mobile workstation products. Solid language skills in English and Mandarin. AI skill preferred with CLI.